Optoelectronic system for inspecting sizes of sieve holes
D.N.Bondar, A.V.Budantsev, E.L.Emelyanov, Yu.V.Obiding, and K.V.Petukhov
Novosibirsk
Pages: 44–51
Abstract
Results of investigation directed to creating an optoelectronic system for inspecting the hole size in sieves used for diamond classification are presented. A technique of determining the sizes of holes by their images is described. Results of investigating the hole dimension measurement algorithm ensuring an error of 3 m and less are discussed. Characteristics of the automatic system for analytical sieve inspection are given.
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