Using PCB layout for maintenance of a thermal mode in very large-scale integrated circuits of space-application electronic blocks
N.P. Semena and A.A. Konovalov
Institute for Space Research of the Russian Academy of Sciences, Moscow, Russia
Pages: 103-110
Abstract
The paper deals with a problem of using modern very large-scale integration circuits developed for space applications and penalized with a high heat power. The method was developed for integration of cooling elements into printed fiberglass boards for proper thermal operation mode. The approach efficiency was demonstrated with the example of a processor module created for the space project “Spectrum-X”.
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